EUV Lithography Yield Improvement
using sub-Angstrom Local Deposition 

EUV Lithography is the most expensive process in the semiconductors manufacturing history. Therefore, Yield improvement is critical to recovering large investment costs and improving ROI.

We developed and patented a disruptive technology, that offers Local Sub-angstrom Deposition, of various materials, so to compensate for all inherent EUV Lithography errors, during the EUV Lithography process.

More specifically, we are targeting the Intra-Field CD Uniformity Tuning, which translates into Yield Improvement, during the Chip Manufacturing process.